Edge AI Performance Is Moving to the Module Level

The density of compute at the edge is shifting from general-purpose processors to specialized, high-TOPS silicon integrated into small form factors. ADLINK’s new COM-HPC-mPTL module demonstrates this shift by bringing Intel Core Ultra Series 3 "Panther Lake" architecture to a COM-HPC R1.3 Mini computer-on-module.

The hardware targets high-performance workloads through significant increases in neural processing unit (NPU) and graphics capabilities. The top-tier configuration utilizes the Intel Core Ultra X7 358H processor, which features 16 cores and 12-core Xe3 graphics capable of 122 TOPS. When paired with a 50 TOPS NPU, this module provides the raw throughput necessary for complex edge AI tasks.

The architecture is not limited to a single performance tier. The module lineup includes:

• Intel Core Ultra 5 325: An 8-core processor providing 40 TOPS from Xe3 graphics and 47 TOPS from the NPU.
• Intel Core Ultra 7 356H: A 16-core processor delivering 40 TOPS from Xe3 graphics and 50 TOPS from the NPU.
• Intel Core Ultra X7 358H: The high-end 16-core option with 122 TOPS from Xe3 graphics and 50 TOPS from the NPU.

This compute density is supported by a high-bandwidth memory subsystem, offering up to 64GB of LPDDR5x at speeds reaching 7467 or 8533 MT/s. Connectivity remains a priority for industrial and edge deployments, with the module exposing I/Os through a standard 400-pin high-density connector. This includes support for up to 16x PCIe lanes across Gen4 and